PARMI 3D SPI
Typ HS60L
• Inline paste inspection system
• Test speed: 100 cm²/s
• Circuit boards: min.50x50mm
• max. 520x510mm
• PCB thickness: 0.4- 4mm
• SMEMA interface
• Year of construction 2012
• Condition: good
• Location warehouse
• Inline stencil printer
• 100% pressure control
• Camera line camera
• PCB size max.
• 550x500mm
• Stencil size:
• max.750 x 750 mm
• min. 450 x 450 mm
• SMEMA interface
• Year of construction 12/2008
• Condition: very good
• Location warehouse