VISCOM AOI 3D Upgrade 2019 • High-end inline 3D AOI • XMplus measuring head • LP size max. 457x356mm • Test speed up to 65 cm²/s • 1 orthogonal camera • 8 oblique cameras • Resolution 10 μm • including verification station • Condition: very good • Location: Warehouse

SIEMENS ASM Type X2 • Inline SMD assembler • Portal 1 DLM3 RV12 with • Camera • 18x18 (Typ28) • Portal 2 DLM3 RV6 with camera • 27x27 (Type 27 High Resolution) • Both portals with Multicolor Cam. • Repeatability: +/- 12.5μm • PCB size (L x W) • 50x50mm2 to 450x508mm2 • Placement accuracy up to • ± 30μm, ± 0.05° at 4 sigma • Condition: very good • Location warehouse ​