Automatic optical inspection system Testable printed circuit boards: Components and solder joint inspection for reflow and wave applications Component failure detection: component presence or failure, placement precision and polarity, optical character recognition Solder defect detection: under/over solder, tombstone, billboard, coplanarity, raised component leads, shorts, lead-free compliant Inspection method: Orbotech's "Dimensional Picture Infomation eXtraction" (DPIX) Type: 3D Post-Reflow AOI System. One high-resolution camera for top view, 4 angled side cameras with multi-angle direct lighting Camera: 4 megapixel camera 2352x1728(top), 4 side cameras Max PCB size: 550 x 470mm, 2009

SMD Inspection machine - Kohyoung Zenith Inline 3D AOI (2018_Never used for production) - Kohyoung Zenith-XL Inline 3D AOI (2017) - Kohyoung Zenith Inline 3D AOI (2015 / 2013) - Kohyoung KY8030-3 Inline 3D SPI (2013) - Pemtron Troi-5500HL Inline 3D SPI (2014) - Pemtron Troi-5700HL Inline 3D SPI (2014) - Parmi Sigma X Inline 3D SPI (2019) - Cyberoptics QX100i Inline 2D AOI (2016_Demo unit) - Cyberoptics SQ3000 Inline 3D AOI (2017_Demo unit) - Mirtec MV-6E Inline AOI (2015) - Mirtec MV-3L Desktop AOI (2013) - Saki BF-Comet 18 Desktop AOI (2015) PCB Test machine - Teradyne TSLH-F718 ICT

X-ray inspection machine, 160kv, SEC, SF-160, Made in Korea