Dual-stage, 2 x Głowica HM, 2 x ScanCamera, 2 x MultiCamera, 2 x Nozzle Station, 4 x FES32

VISCOM AOI 3D Upgrade 2019 • High-end inline 3D AOI • XMplus measuring head • LP size max. 457x356mm • Test speed up to 65 cm²/s • 1 orthogonal camera • 8 oblique cameras • Resolution 10 μm • including verification station • Condition: very good • Location: Warehouse

Ersa EWS 330 wave soldering machine. - Pallet conveyor - ESF Spray fluxer - Preheating: MW, Convection, Quartz IR, approx. 90cm - Lead free solder pot with 2 soldering waves