PARMI 3D SPI Typ HS60L • Inline paste inspection system • Test speed: 100 cm²/s • Circuit boards: min.50x50mm • max. 520x510mm • PCB thickness: 0.4- 4mm • SMEMA interface • Year of construction 2012 • Condition: good • Location warehouse

ERSA ETS 330 Wave Soldering System 2006 Used with lead-free production PCB width max. 330mm Microprocessor Control System Foam fluxer, 12 liter tank Preheating 600-800mm Double wave solder Solder pot capacity 390kg

Konfiguracja standardowa: Integral Machine Mounted Monitor and PC Inerted Nitrogen System Auto Solder Top-up (Wire Feed) & Solder Level Detect Single Titanium Drop Jet Fluxer - 200 Micron Internal Fume Extraction Colour Programming Camera Universally Adjustable Tooling Carriers 508mm (X) x 457mm (Y) (20” x 18”) Maximum PCB Handling Size Manual Fiducial Correction System PillarPAD Offline Programming Package Thermal Nozzle Calibration System using Integrated Setting Camera (requires manual correction) PillarCOMMX Windows Software Solder Wave Height Measurement Process Viewing Camera Multilevel Password Security System Lead-Free Capability Set of AP Solder Tips (2.5mm, 3mm, 3.5mm, 4mm, 5mm, 6mm, 8mm, 10mm & 12mm) Standard Production Data Export (CSV File with Configurable Board Process Data) Accessory Kit Plus dodatkowe wyposażenie: Top Side IR Pre-Heat Closed Loop Thermocouple Top-Side Pre-Heat Control Initial Lead-Free Solder Fill – SAC305 Nitrogen Analyser - (Measures the oxygen content within the incoming nitrogen into machine). Real Time PCB Warp Correction System X, Y & Z Axis Encoders Vacuum Packaging (Jade MKII)

YJ Link ALD-CE, Loader – 150 cm – (2013) good working condition