ASSEMBLEON TOPAZ Year 1999 Automatic pick and place machine Running, sold as is Pneumatic feeders included, aprox 100 pieces Includes 1 vibration feeder Built-in tray holder 14,000 CPH 50x50mm up to 457x407mm PCB size SMEMA connection Two up-looking cameras Feeder trolley included Datasheet PDF attached

IBL SLC 309 Localization north of Europe.

Automatic optical inspection system Testable printed circuit boards: Components and solder joint inspection for reflow and wave applications Component failure detection: component presence or failure, placement precision and polarity, optical character recognition Solder defect detection: under/over solder, tombstone, billboard, coplanarity, raised component leads, shorts, lead-free compliant Inspection method: Orbotech's "Dimensional Picture Infomation eXtraction" (DPIX) Type: 3D Post-Reflow AOI System. One high-resolution camera for top view, 4 angled side cameras with multi-angle direct lighting Camera: 4 megapixel camera 2352x1728(top), 4 side cameras Max PCB size: 550 x 470mm, 2009