This is a FLX2011-V, Serial number: 119567, Date of manufacture: 06.22.2011 As you can see in the attached photos, it is in perfect condition, the company has taken excellent care of it and maintenance has always been carried out by Essemtec. The machine would be for sale with 4 Feeders: -CLM950 -CLM 950 -CLM957 -CLM952

Type of machine: Reflow oven MR933+ R to L flow (9 heating / 3 cooling zones, Year of production 2013 Model: MR933+ (AIR atmosphere) Running at costumer site still Additional information: Dimmensions (WxDxH): 4.7 x 1.5 x 1.4m 2200 kg (Machine) Tech status: Producing (untill 17.01.2024) Sold AS is. Available for sale: CW03 2024

Both machines are in the same configuration, they differ in the year of production: the first machine is from 2017 and the second from 2019.

ERSA Ecoselect 350 Baujahr 06/2006 Semi-Automatic Selective Soldering System The solder pots are filled with: 1. Sn 63 Pb37 (1269080-00) 2. Sn 96,5 Ag 3,5 (1350857-00) Dimensions: Length: 1,350 mm Width: 2,500 mm Height: 1,330 mm Weight: approx. 900 kg / 1,300 kg (with additional soldering module) Paint: RAL 7035 / 7016 Electrical Data: Voltage: 5-wire system, 3 x 230/400 V / N / PE Power tolerance range: +6 %, -10 % Frequency: 50 or 60 Hz Power consumption: min. 7,2 - 42 kW Amperage: max. 18 - 63 A max. fuse rating: 3 x 63 A (tr) Environmental specification (factory): Ambient temperature: max. 30 °C Positioning system: 2- axis (X,Y) servo driven Z -axis, standard pneumatic driven, optional servo driven motor Positioning speed: 0.1 - 15 m/min Positioning accuracy: ± 0.25 mm Flux module: Type: high-precision spray fluxer Flux storage tank: 2 l Flux speed: 0.1 - 2.5 m/min Spray width (130 µm-nozzle): 3 - 6 mm, second nozzle available as an option Preheat module: Type: short-wave heaters Capacity: max. 10,2 kW; 6 emitters with 1700 W each Useful dimensions: 350 mm Length / 300 mm Width Type: bottom side convection Capacity: max. 3,1 kW; Useful emission space: 25 cm² Solder module 1: Capacity: approx. 3,500 W Solder volume: approx. 130 kg (when using Sn63Pb37) approx. 110 kg (when using SnAg3,8Cu0,7) Warm-up time: approx. 2 h Solder temperature: max. 300°C Solder nozzle diameter: 4.5 / 6 / 8 /10 mm additional nozzles available on request Clearance from PCB-edge: min. 3 mm Soldering speed: 0,1 - 1,0 m/min Standard: 1 soldering nozzle Optional: additional nozzles on request Solder module 2: Additional solder pot with customized nozzle plate to solder all selective soldering joints simultaneously Working window: 350 x 300 mm Type: Dip-Module Soldering nozzle: customized multi-fountain design Solder volume: ca. 350 kg (when using Sn63Pb) Solder temperature: max. 300°C Warm-up time: 2.5 hours Positioning accuracy: ± 0,25 mm

• Inline stencil printer • 100% pressure control • Camera line camera • PCB size max. • 550x500mm • Stencil size: • max.750 x 750 mm • min. 450 x 450 mm • SMEMA interface • Year of construction 12/2008 • Condition: very good • Location warehouse