VISCOM AOI 3D Upgrade 2019 • High-end inline 3D AOI • XMplus measuring head • LP size max. 457x356mm • Test speed up to 65 cm²/s • 1 orthogonal camera • 8 oblique cameras • Resolution 10 μm • including verification station • Condition: very good • Location: Warehouse

ERSA Ecoselect 350 Baujahr 06/2006 Semi-Automatic Selective Soldering System The solder pots are filled with: 1. Sn 63 Pb37 (1269080-00) 2. Sn 96,5 Ag 3,5 (1350857-00) Dimensions: Length: 1,350 mm Width: 2,500 mm Height: 1,330 mm Weight: approx. 900 kg / 1,300 kg (with additional soldering module) Paint: RAL 7035 / 7016 Electrical Data: Voltage: 5-wire system, 3 x 230/400 V / N / PE Power tolerance range: +6 %, -10 % Frequency: 50 or 60 Hz Power consumption: min. 7,2 - 42 kW Amperage: max. 18 - 63 A max. fuse rating: 3 x 63 A (tr) Environmental specification (factory): Ambient temperature: max. 30 °C Positioning system: 2- axis (X,Y) servo driven Z -axis, standard pneumatic driven, optional servo driven motor Positioning speed: 0.1 - 15 m/min Positioning accuracy: ± 0.25 mm Flux module: Type: high-precision spray fluxer Flux storage tank: 2 l Flux speed: 0.1 - 2.5 m/min Spray width (130 µm-nozzle): 3 - 6 mm, second nozzle available as an option Preheat module: Type: short-wave heaters Capacity: max. 10,2 kW; 6 emitters with 1700 W each Useful dimensions: 350 mm Length / 300 mm Width Type: bottom side convection Capacity: max. 3,1 kW; Useful emission space: 25 cm² Solder module 1: Capacity: approx. 3,500 W Solder volume: approx. 130 kg (when using Sn63Pb37) approx. 110 kg (when using SnAg3,8Cu0,7) Warm-up time: approx. 2 h Solder temperature: max. 300°C Solder nozzle diameter: 4.5 / 6 / 8 /10 mm additional nozzles available on request Clearance from PCB-edge: min. 3 mm Soldering speed: 0,1 - 1,0 m/min Standard: 1 soldering nozzle Optional: additional nozzles on request Solder module 2: Additional solder pot with customized nozzle plate to solder all selective soldering joints simultaneously Working window: 350 x 300 mm Type: Dip-Module Soldering nozzle: customized multi-fountain design Solder volume: ca. 350 kg (when using Sn63Pb) Solder temperature: max. 300°C Warm-up time: 2.5 hours Positioning accuracy: ± 0,25 mm

I am selling a machine for PCB mounting. The machine is fully functional, it has been replaced by a new machine and will no longer be used in the company.

- F4 ( refurbished in 2004) - F25 ( vintage 2002) - S27 HM with Highcam, component sensor (vintage 2006) Waffeltray WPW 28 tray - Feeders (62x 3x8mm gold/silver, 54x 2x8mm, 23x 12/16mm, 6x 24/32mm, 4x 44mm, 2x 56mm, 22x ) - Saki BF planet X2 ( vintgae 2015) - Viscom S3088 Ultra Chroom AIO ( vintage 2020)

1. Sitodrukarka Ekra X4, year 2013 2. Automat P&P Juki KE-2070L year 2013 Working hours: 29 882 rbg 3. Automat P&P Juki KE-2070L wyposażony w kamerę procesową, Year 2013 working hour : 29 839 rbg 4. Piec ERSA Hotflow 2/12 year 2010 Working hours : 30237 rbg 5. Licencja serwerowa IS (Inteligent Shopfloor) – soft zarządzający pracą maszyn JUKI 6. Akcesoria do automatów JUKI: