• Inline reflow oven
• Preheat: 7 top/7 bottom
• Solder zone: 3 above/3 below
• Power cooling with 4 zones
• Working width: 45 – 580 mm
• SMEMA interface
• Year of construction 06/2011
• Process chamber cleaned
• Condition: good
• Location warehouse
VISCOM AOI 3D
Upgrade 2019
• High-end inline 3D AOI
• XMplus measuring head
• LP size max. 457x356mm
• Test speed up to 65 cm²/s
• 1 orthogonal camera
• 8 oblique cameras
• Resolution 10 μm
• including verification station
• Condition: very good
• Location: Warehouse
