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PARMI 3D SPI Typ HS60L • Inline paste inspection system • Test speed: 100 cm²/s • Circuit boards: min.50x50mm • max. 520x510mm • PCB thickness: 0.4- 4mm • SMEMA interface • Year of construction 2012 • Condition: good • Location warehouse

ASSCON vapor phase reflow soldering systems set standards in soldering technology. The VP 2000 inline series are based on advanced patented high-tech soldering methods, and offer outstanding soldering quality in large series production. * reproducible process conditions * low energy costs thanks to smart energy management * low overall running costs * full traceability capability * product changing without waiting times